imaginary_num6erB to Hardware@hardware.watchEnglish · 1 year agoSK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing coreswww.tomshardware.comexternal-linkmessage-square18fedilinkarrow-up13arrow-down10
arrow-up13arrow-down1external-linkSK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing coreswww.tomshardware.comimaginary_num6erB to Hardware@hardware.watchEnglish · 1 year agomessage-square18fedilink
minus-squareExist50BlinkfedilinkEnglisharrow-up1·1 year agoThese are all in flip-chip packages. So no, power would come up through the bottom, and the transistors would be closest to the top.
These are all in flip-chip packages. So no, power would come up through the bottom, and the transistors would be closest to the top.